Build a Microcontroller Based Interactive Module as A Learning Medium in Vocational Secondary Schools


Author

Bobi Kurniawan S, ST.,M.Kom

Abstrak

The purpose of this research is to build an interactive and complete module to be used as a learning medium at the vocational secondary school level. The prototype method is one of the ways that can be used to build microcontroller modules to suit your needs. The prototype methods include communication, planning, modeling, construction, and development. Microcontrollers are one of the learning media that has a high level of difficulty in understanding each device's usage. The trainer module that has been circulating in the market and the students are still not complete and not interactive. During this time, the microcontroller module used focuses on the creation of microcontroller trainer modules using dot matrix, keypad, LCD, digital I/O, and traffic light. In building a complete and interactive microcontroller module, it takes an appropriate method to construct it. Meanwhile, the media needs learning with the development of technology requires a more complete module in addition to the components that are already used in general. In the design of an interactive module, the microcontroller used to have more complete devices including additions to servo motors, potentiometer, temperature sensors, proximity sensors, DC motors, and the addition of WiFi modules as a complete facility of interactive microcontroller modules. The results showed that the features offered had a 50% more complete compared to previous microcontroller modules, and more interactive could use WiFi networks. With the more complete a microcontroller module, it can be easier for students to understand each implementation and can improve the competency of the students in the use of microcontrollers.

Detail Prosiding

Penelitian Induk: -
Jenis Publikasi:Prosiding Internasional Terindeks Scopus
Jurnal:International Conference on Informatics, Engineering, Science, and Technology (INCITEST 2020)
Volume:879
Nomor:1
Tahun:2020
Halaman: -
P-ISSN:-
E-ISSN:1757-899X
Penerbit:IOP Conference Series: Materials Science and Engineering
Tanggal Terbit:2020-08-05
URL: https://iopscience.iop.org/article/10.1088/1757-899X/879/1/012107
DOI: -